Kia America has initiated a recall of more than 80,000 Niro vehicles from model years 2023-2025 due to a critical wiring ...

TSMC plans to build 2nm chips at one of its U.S. fabs in Arizona by 2028. As great as that sounds for U.S. tech companies ...

Increasing engineering efficiency will require lowering the AI expertise barriers for everyone in the chip industry.

Rising complexity and heterogeneous integration are reshaping test methodologies and fault coverage, but challenges persist.

all within the transistor package. Eight pins are standard so far for the TO-circuit package. Other manufacturers have been pursuing other techniques. TI, Westinghouse, and Burroughs, for example ...

Department of Physics and Institute of Quantum Convergence Technology, Kangwon National University, Chuncheon 24341, South Korea ...

Another way is building 3D chips, which squeeze more transistors into the same area without making transistors smaller. Kim’s team did both, building a 3D chip out of vertically stacked 2D ...

In a world grappling with a multitude of health threats—ranging from fast-spreading viruses to chronic diseases and drug-resistant bacteria—the need for quick, reliable, and easy-to-use home ...