Explore the critical standards for wire harness-to-PCB connections and ensure your assemblies meet industry requirements.

Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

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A reflow profile with a high ramp-up rate or a too-rapid temperature increase can lead to solder splattering and formation of ...

The Pocket SNES is a portable console inside a controller shell. Designing the enclosure for the Pocket SNES was challenging ...

It charges via a USB-C port, making it the perfect ... be soldering on and the size of the components you will be soldering onto a PCB. Since everyone may not have the same use case, we've added ...

The SBW was implemented using two PCB substrate ground planes, with solder balls placed in the space between them, to form a waveguide. The structure of the transition was designed in the form of a ...

The quality of the soldering has a tremendous impact on the overall quality of the PCB. Through soldering, different parts of the PCB are connected to other electrical components to make a PCB ...