The company offers die attach equipment, such as single chip, multi-chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, thermos compression and embedded bridge die ...

Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.

Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

ITEC has released the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines and can attach up to 60,000 flip-chip dies per hour. The company aims to help ...

“But where there are challenges, there are solutions. With flip-chip, you try to get rid of the heat from the bottom when you do die attach, so you use a heat sink and thermal grease at the interface.

Another problem associated with die-attach is the pressure ... [2] Material advances in underfill, the electrically insulating adhesive layer in the flip chip (not to be confused with “underfilling” ...

TDK Corporation product highlights at the show include: AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder: TDK will feature its AFM GGI flip chip model which includes new horn capability for ...

In addition, due to the fast growth in emerging markets for mobile applications, advanced Si node technology development for mobile applications is moving to 10nm technology (and below) and pursuing ...