Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.

From there it can move up, which in a flip-chip package means through the bulk silicon ... The natural paths for heat to flow are through the interface between the die and the substrate — i.e., the ...

The company offers die attach equipment, such as single chip, multi-chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, thermos compression and embedded bridge die ...

rumours suggest Samsung might replace Qualcomm’s flagship processor with an in-house Exynos chip, marking a significant change from last year’s Snapdragon 8 Gen 3-powered Galaxy Z Flip 6.

The Galaxy S26 series chip plan revives Samsung’s dual-chip strategy after the Snapdragon-exclusive S25 series, driven by Exynos 2500’s yield issues. A recent report out of South Korea claims ...

Abstract: Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems, it permits the integration of technologies from disparate backgrounds and ...

Built on TSMC’s second-generation 3nm process, the chip packs 19 billion transistors into a 109mm² die and powers the new Xiaomi 15S Pro and Xiaomi Pad 7 Ultra. The launch marks a major shift ...

The white paper, "GUC GLink Test Chip Uses In-Chip Monitoring and Deep Data Analytics for High Bandwidth Die-to-Die Characterization," is available here. The presentation titled "GUC’s GLink Case ...

Rather than shopping online for yard or garden features, try this simple DIY involving an underused chip-and-dip tray. Visiting birds will feel very festive.