Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.

The company offers die attach equipment, such as single chip, multi-chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, thermos compression and embedded bridge die ...

Rather than shopping online for yard or garden features, try this simple DIY involving an underused chip-and-dip tray. Visiting birds will feel very festive.

and flip-chip is an important enabling technology for these product trends. Underfill between the die and an organic substrate is necessary to compensate for the coefficient of thermal expansion ...

Abstract: Miniaturization and high performance demand more and more flip chip and chip scale packages for consumer products. New packages require increased functionality with a reduction in overall ...