Abstract: Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller, lighter, and less expensive packages, and flip-chip is an important ...

The Samsung Galaxy Z Fold 7 and Z Flip 7 FE have passed by the FCC, revealing some chipset, connectivity, and battery details ...

flip chip BGA substrate. Bump stress, die stress and Cu trace stress of substrate were simulated by FEA (Finite Element Analysis) method, the results indicate that coreless flip chip BGA performs ...