Apple to reportedly use TSMC's advanced WMCM and SoIC packaging for next-gen A20 and server chips, monthly wafer production ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...

Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.