Nordic Semiconductor and Kigen, a developer of eSIM security solutions for the IoT, have announced a technical collaboration ...

Wire bonding is a critical yet often overlooked process in electronics manufacturing, but plays an indispensable role.

At 2024 IEDM, imec and its partners within the Q-COMIRSE project (Ghent University, QustomDot BV, ChemStream BV and ams OSRAM ...

ECSN projects a return to growth for the electronics components market in 2025 after a very weak performance in 2024.

u-blox has introduced an ultra-low power GNSS chip that represents a major advance in compact and efficient positioning ...

DigiKey has announced that it has expanded its product portfolio through a global distribution partnership agreement with ...

Microchip Technology has released PolarFire FPGA and SoC solution stacks for smart robotics and medical imaging.

Jmem Tek, a specialist in security and post-quantum cryptography for IoT devices, partners with Andes Technology.

Quobly, a quantum computing startup, is working with STMicroelectronics to produce quantum processor units at scale.

OKI Circuit Technology develops a multi-layer PCB technology with stepped copper coin insertion for heat management.

Apple to announce a 3-year modem rollout that will replace components supplied by Qualcomm, according to reports.

HaLowLink 1 is a reference-designed Wi-Fi HaLow Access Point, expanding Morse Micro's suite of IoT evaluation tools.