Next-gen MCUs and MPUs deliver scalability with a range of performance, features, and costs to meet a variety of application ...

Cadence launches the Tensilica NeuroEdge 130 AI co-processor for physical AI applications, delivering greater performance ...

AOS Gen3 SiC MOSFETs provide up to a 30% improvement in switching FOM, while maintaining low conduction losses at high-load ...

Hirose’s KM32A wire-to-board connector meets the GMW3191 standard for low-voltage automotive applications.

The best approach now to securing LPWA IoT is developing products that are upgrade-ready and support crypto agility.

Skew represents a major design challenge for 224 Gbits/s PAM4 applications, causing delay differences within a differential ...

Aledia will showcase its FlexiNOVA customizable microLED platform for wearables, automotive, and consumer displays at Display Week 2025. Aledia will demonstrate its new FlexiNOVA customizable microLED ...