Since its inception in 2017, the India Mobile Congress (IMC) has evolved in tandem with India’s dramatic transformation from a major telecom consumer into a formidable global digital architect. Over ...

The firm NXP Semiconductors has announced the first industry standard 10BASE-T1S Physical Medium Dependent transceiver chips that have been put into production. Two different models have been designed ...

This investment by Rolls Royce will be used to improve their manufacturing and engineering capacity in the United Kingdom and is intended to increase the company’s footprint in the high tech ...

The Hyderabad-based space technology startup company called Skyroot Aerospace is involved in highly advanced talks that can result in securing a very large funding deal worth $280 million-$300 million ...

Infineon Technologies AG officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan, together with Anutin Charnvirakul, Prime Minister of Thailand and Alexander Gorski, Chief ...

Pickering Interfaces has introduced the 65-217, a modular 2A Ethernet-controlled LXI matrix that lets test engineers expand system capacity as requirements change. Designed for the 65-200 scalable LXI ...

DigiKey, the global distribution leader of electronic components and automation products, announces the launch of Season 6 of Factory Tomorrow, a video series highlighting how manufacturers and ...

TDK Corporation presents the B3272*A/G/T series of DC-link film capacitors. These are qualified for continuous operation at case temperatures of up to +135 °C, with no derating required up to +105 °C.

Infineon Technologies AG, a global leader in USB semiconductor solutions, announced a new PCI Express® Gen4 x4 add-on card reference design that addresses key barriers to USB 20Gbps (USB 3.2 Gen 2×2) ...