High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

TSMC plans to build 2nm chips at one of its U.S. fabs in Arizona by 2028. As great as that sounds for U.S. tech companies ...

Increasing engineering efficiency will require lowering the AI expertise barriers for everyone in the chip industry.

all within the transistor package. Eight pins are standard so far for the TO-circuit package. Other manufacturers have been pursuing other techniques. TI, Westinghouse, and Burroughs, for example ...

Department of Physics and Institute of Quantum Convergence Technology, Kangwon National University, Chuncheon 24341, South Korea ...

Another way is building 3D chips, which squeeze more transistors into the same area without making transistors smaller. Kim’s team did both, building a 3D chip out of vertically stacked 2D ...