The rapid technological advancements of our world have been enabled by our capacity to design and fabricate ever smaller ...
Electronic component manufacturers, from AI chips to wireless SoCs, showcased their latest innovations and technologies at ...
Is 40% lower in height than our previous product in the MCOIL LSCN series of multilayer metal power inductors and is as thin as 0.33mm, contributing to the miniaturization and thickness reduction of ...
KYOTO, Japan, January 07, 2025--(BUSINESS WIRE)--Murata Manufacturing Co., Ltd. (TOKYO:6981) (ISIN:JP3914400001) announces the development of the world’s smallest class 006003-inch size (0.16 mm x ...
The "LSCND1005CCTR47MH" is 40% lower in height than our previous product, the "LSCNB1005EETR47MB" (1.0 x 0.5 x 0.55 mm), and realizes a metal power inductor as thin as 0.33 mm. This will contribute to ...
The "LSCND1005CCTR47MH" is 40% lower in height than our previous product, the "LSCNB1005EETR47MB" (1.0 x 0.5 x 0.55 mm), and realizes a metal power inductor as thin as 0.33 mm. This will ...
TDK CORP. PLE856C Series (0.80 x 0.45 x 0.65mm; LxWxT) compact thin-film power inductors are suitable for wearable devices. Tiny devices feature inductances from 470nH to 1.5µH for power supply ...
MIT engineers have developed a method to seamlessly stack electronic layers to create faster, denser, more powerful computer chips. The team deposits semiconducting ... covered a silicon wafer in a ...
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