Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Inside the latest 16-phase power controller from Alpha and Omega Semiconductor and how it helps feed power-hungry GPUs and ...

With advanced NoC tools, SoC designers will be able to address escalating design requirements with greater efficiency.

As AI pushes the boundaries of chip design, it raises a dilemma: can we trust systems we don’t fully understand?

The Z2 Go and Z1 Extreme are two of the most capable handheld gaming CPUs out there, but how do they compare and which is ...

Custom chips optimized for specific use cases are already demonstrating how we can continue to increase performance while cutting power.

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

Apple released a series of press updates during the last week of October 2024 to introduce their entire Mac lineup to the M4 ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Developed by ESA, the tiny signal amplifier is aimed at making the future radar-observing and telecommunications space ...

According to a new leak, the chip design for the future PlayStation 6 is essentially complete and nearly ready to enter the manufacturing phase. Sony is currently trying to convince gamers that ...

The US government has announced a radical plan to control exports of cutting-edge AI technology to most nations.