Discover Arm's Chiplet System Architecture (CSA) and how it's revolutionizing chipset connectivity and system partitioning.

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

SemiQ Inc, a developer of SiC devices has announced a family of 1700 V SiC MOSFETs designed to meet the needs of ...

Developed by ESA, the tiny signal amplifier is aimed at making the future radar-observing and telecommunications space ...

Preparing to offer just that in significant volume within the next few years is the Israeli-based producer of GaN power ...

Jan 9 (Reuters) - Nvidia on Thursday criticized a reported plan by the Joe Biden administration to impose new restrictions on AI chip exports, saying that the outgoing U.S. leader should not ...

The Morse Micro MM8108 SoC achieves data rates of 43.33 Mbps with power optimization and integrated USB, SDIO, and SPI host interfaces.

SEOUL (Reuters) - Samsung Electronics, the world's top memory chip maker, is expected to forecast on Wednesday its profit growth continued to slow in the fourth quarter as it struggled to keep up ...

Specialized microchips that manage signals at the cutting edge of wireless technology are astounding works of miniaturization and engineering. They're also difficult and expensive to design. Now, ...