indicating the efficiency of the inductor. Through-silicon-via (TSV): A vertical electrical connection that passes through a silicon wafer or die, used to connect different layers of integrated ...

The PDN is made up of the capacitors, PCB traces, layers, and vias that are used to connect the output of the regulator ... s ...

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Note in the examples above that the oscillation peaks differ by 0.16% and that the reactance of the L1 inductor and the reactance of the ... control of the Clapp circuit is primarily set by the series ...

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This is because the capacitor does not have enough energy to provide the required voltage gain when a PPC operates at zero series port voltage ... to charge the inductor with energy, enabling current ...