These rack-scale systems employ cabled backplanes, blind-mate 2D cabling, and liquid cooling to optimize maintenance and thermal management. This open design aligns with Open Compute Project ...

The modules are powered by TI's 10th-generation connectivity chip (CC3301), delivering application throughput of up to 50 Mbps and are designed for reliable performance in extreme conditions (-40°C to ...

The surface-mount DFN8x8 package reduces volume by more than 90% compared to existing lead-inserted packages, such as TO-247 and TO-247-4L(X), improving the power density of equipment while enabling ...