Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.

Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

Abstract: Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems, it permits the integration of technologies from disparate backgrounds and ...

Xiaomi XRING O1 was launched on May 22 It is the first in-house chip developed by Xiaomi The Xiaomi XRING O1 features a 16-core GPU ...

From there it can move up, which in a flip-chip package means through the bulk silicon ... The natural paths for heat to flow are through the interface between the die and the substrate — i.e., the ...

The Galaxy S26 series chip plan revives Samsung’s dual-chip strategy after the Snapdragon-exclusive S25 series, driven by Exynos 2500’s yield issues. A recent report out of South Korea claims ...

Abstract: Flip-chip packaging is desirable for microelectromechanical systems ... we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology ...

So while the analysts sit on their hands and the market shrugs, big firms are carefully placing their bets, hoping Intel’s next chip innovation doesn’t come preloaded with bugs—or budget holes.