Topping the list of interest for embedded system designers is Bluetooth Channel Sounding. The breakthrough feature, part of the Bluetooth Core specification 6.0 release, is designed to increase ...
Eliyan, a startup co-founded in 2021 by three experienced networking, connectivity, chip architecture and packaging serial entrepreneurs, recently announced details of its chiplet connectivity ...
The comparison of edge AI and cloud AI is built on the foundation of the “edge computing versus cloud computing” debate. Cloud computing leverages remote data centers to deliver on-demand computing ...
While demand for proximity detection continues to grow across IoT, automotive, and logistics applications, current solutions remain hindered by insecurity and imprecision. Bluetooth Channel Sounding ...
At the International Electron Device Meeting (IEDM) held in San Francisco last December, TSMC introduced its 2nm process technology, highlighting advancements in nanosheet transistors. Branded as N2, ...
Boris Radonic is a Research and Development Engineer with more than 30 years of experience in Electronic Engineering, Control Systems, and Software Engineering, focusing on real-time applications. He ...
Market demands for powerful and responsive graphical user interfaces (GUIs) are constantly growing, posing additional challenges for developers. This paper focuses on exploring these challenges and ...
Over the past few years, countries around the world have decided to subsidize their domestic semiconductor ecosystems with an unprecedented amount of money. European Union member states made such a ...
Artificial intelligence in the automotive sector is transforming the way we interact with vehicles and the world around us, redefining the idea of mobility. From a traditional means of transport to ...
Quantum Ventura developed the CyberNeuro-RT (CNRT) solution in collaboration with Lockheed Martin Co.’s MFC Division and Pennsylvania State University, partially funded by the U.S. Department of ...
Battery modules and packs are subjected to various stresses during their lifecycle, including electrical, thermal, and mechanical stress. A comprehensive approach to testing is needed to ensure that ...
In today’s rapidly evolving tech landscape, companies are pushing the boundaries of innovation to meet the growing demand for smaller, more powerful embedded solutions. From ultra-compact ...
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