Cadence launches the Tensilica NeuroEdge 130 AI co-processor for physical AI applications, delivering greater performance ...

Next-gen MCUs and MPUs deliver scalability with a range of performance, features, and costs to meet a variety of application ...

AOS Gen3 SiC MOSFETs provide up to a 30% improvement in switching FOM, while maintaining low conduction losses at high-load ...

Skew represents a major design challenge for 224 Gbits/s PAM4 applications, causing delay differences within a differential ...

Hirose’s KM32A wire-to-board connector meets the GMW3191 standard for low-voltage automotive applications.

The best approach now to securing LPWA IoT is developing products that are upgrade-ready and support crypto agility.

Wise-integration, in collaboration with Savoy, debuts a 7-kW SiC demo board for on-board chargers at PCIM 2025.

Synaptics releases its first Veros triple-combo Wi-Fi 7 SoCs, supporting Wi-Fi, Bluetooth, and Zigbee/Thread with Matter ...

Silanna’s factory-configurable ADC Plural platform delivers improvements in affordability and lead times compared to legacy ...

AKM and SAL have developed a joint proof of concept for integrating a current sensor into a power module for automotive ...

SemiQ showcases its latest Gen3 SiC MOSFET series, targeting industrial and automotive applications, at PCIM 2025.

Novosense debuts an automotive-grade audio amplifier and temperature/humidity sensor for smart cockpit systems at PCIM 2025.