Nippon Electric Glass Co. has embarked on developing an innovative glass core substrate compatible with CO2 laser processing, aiming to enhance the efficiency of manufacturing next-generation ...

AXT, Inc. manufactures compound semiconductor substrates, benefiting from strong industry tailwinds, but faces volatile revenue and margin performance. AXTI trades at a $2 billion market cap, despite ...

South Korean electronics manufacturer LG Innotek arrived in Orlando, Florida this week to court North American chip designers ...

South Korean materials manufacturer Lotte Energy Materials announced this week that it will quadruple annual circuit foil ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in data centers.

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

Produces compound and single element semiconductor substrates, including indium phosphide, gallium arsenide (GaAs), and germanium, serving applications in data center connectivity, 5G, fiber optics, ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

Taiwan’s major substrate makers are expected to see stronger pricing momentum in the second half of the year, supported by ...

Kyocera is bringing out a multilayer ceramic core substrate for semiconductor packages which are rapidly scaling in complexity as AI datacenter architectures evolve. Built from Kyocera’s proprietary ...

Why it matters: Many believe that glass substrate technology will enable the industry to sustain Moore's Law beyond 2030, ensuring continuous development without being constrained by process size ...