Competition over glass substrates for computer chips intensifies
Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms ...
중앙일보4d
Plan for 1 chip fab puts Korea well behind U.S., Japan
Samsung's new foundry leader acknowledges that company is 'behind' Samsung's Taylor plant to make Groq's AI chips on 4nm nodes There is no time to waste in the global chip war (KOR) There is no time ...
Digi Times16d
South Korea invests US$24.79 million in 48 next-gen chip R&D projects
chips, advanced packaging, on-device AI semiconductors, system semiconductors, and compound power semiconductors. Major investment in core semiconductor technologies As reported by ZDNet Korea ...
Datacenter Dynamics16d
Samsung’s advanced chip packaging VP Lin Jun-Cheng leaves company
Following a letter from the company’s co-CEO Jun Young-hyun apologizing for the company’s disappointing preliminary Q3 2024 ...