Inside the DIP package, the IC die itself is mounted to a metal assembly called the lead frame. The lead frame is easily formed by a progressive stamping press, in which a series of dies punch the ...

A common type of chip package that uses metal leads that extend outside the housing. Lead frame technology goes back to the early days of DIP chips, but is still widely used in many package varieties.

You can achieve a lot with a Dremel. For instance, apparently you can slim the original NES down into the hand-held form-factor. Both the CPU and the PPU (Picture Processing Unit) are 40-pin DIP ...