Engineered to withstand 3,000+ thermal cycles at -40 °C/125 °C across different PCB finishes and component types, Durafuse ® HR is ideal for applications requiring an extended mission profile beyond ...
Developed through a close, collaborative relationship with Mycronic, PicoShot ® NC-6M has been beta-tested at customer sites, demonstrating proven performance and advantages over comparative material.
As a provider of advanced materials solutions for power device packaging, Indium Corporation will feature its lineup of high-reliability products at APEC 2026, March 22 to March 26, in San Antonio, ...
USA: Indium Corp. announced a new solder paste technology. BiAgX is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed ...
LONDON — Indium Corp. (Utica, New York) has announced it is adding a surcharge to the price of its silver- and tin-containing solder paste products, with immediate effect. Indium did not explicitly ...
- High-reliability alloys, which perform better than SAC for automotive applications, enable reliable solder interconnect when thermal cycling up to 150 degree C. Indium Corporation's Indalloy 276 and ...
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