SAN JOSE—Microsoft became the seventh core member of the Hybrid Memory Cube Consortium led by Micron and Samsung, a sign of the broad technical implications for the concept of 3-D memory chip stacks.

A major breakthrough with HMC is the long-awaited utilization of advanced technologies to combine high-performance logic with state-of-the-art DRAM. With this first HMC milestone reached so quickly, ...

Micron announced today that it's now shipping early samples of its Hybrid Memory Cube to customers and early adopters. Currently the company is offering a 2GB HMC device composed of four-high stacks ...

The Hybrid Memory Cube Consortium, which consists of such silicon luminaries as Micron, Samsung, and IBM (but not Intel), has finally finished hammering out the Hybrid Memory Cube 1.0 standard. The ...

GigaStacey writes that Samsung and Micron are collaborating on a new type of memory chip designed for HPC. The two firms have formed the Hybrid Memory Cube Consortium to build a chip with 15x more ...

The final spec for the Hybrid Memory Cube (HMC) is done. Designed to improved DRAM performance by a factor of 15, the Hybrid Memory Cube Consortium (HMCC) standard specifies a high-speed, low-overhead ...

BOISE, Idaho, April 24, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc., (Nasdaq:MU) announced today that its Hybrid Memory Cube was named the Memory Product of the Year by a panel of industry ...

BOISE -- Boise-based Micron Technology is teaming up with Samsung to develop a new memory technology. Micron and Samsung have founded the Hybrid Memory Cube Consortium. They'll work closely with three ...