Copper’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of copper (Cu) ...

Chemical Vapor Deposition (CVD) is a widely used technique in materials science, particularly in the fabrication of thin films and coatings, as well as the synthesis of advanced materials. It involves ...

A pathway for ALD-enhanced materials to be quickly developed and transitioned from lab-scale to commercial production is available for almost any application, for the first time ever. Atomic-level ...

Atomic layer deposition (ALD) used to be considered too slow to be of practical use in semiconductor manufacturing, but it has emerged as a critical tool for both transistor and interconnect ...